You are probably already using STM32WB and STM32WL Series from STMicroelectronics, but do you know ST is also proposing the perfect RF integrated passive device (RF IPD) Companion chips for these Microcontrollers?

ST integrated passive devices (Baluns and Filters) offer a competitive cost structure, a small form factor, and reduced power losses:

ST’s baluns use the monolithic RF IPD process to integrate high-quality RF passive components on a single glass substrate. ST’s RF IPD baluns are optimised for high RF integration and improve system performance. They simplify RFIC-to-antenna matching networks and their integrated harmonic filters aid compliance with major EMC regulations like CCC, FCC, ETSI, and ARIB.

RF front-end filters address a variety of functions, such as band-pass, low-pass, and high-pass filters. RF filters can be easily integrated into front-end modules using ST's thin-film RF IPD process. This process integrates high-quality passive RF components into a single glass or high-resistance silicon substrate.